SK hynix accelerates development of 3D-stacked DRAM for AI systems
SK hynix is stepping up development of 3D-stacked DRAM-on-Logic for next-generation AI hardware, including mobile devices. The company has started hiring specialized engineers through its US subsidiary in San Jose and has already signed an agreement with a specific client to develop solutions based on this technology.
SK hynix
3DNews26.07 · 15:02

