Silicon Photonics Team Secures Tens of Millions in Angel Funding Targeting CPO/OIO Next-Gen Optical Interconnect Solutions
Liangyin Technology, an optical chip company, has completed tens of millions of yuan in angel financing, led by Zhuhai Technology Industry Group, with Zhuhai Zhengfang Group and Xianfeng following. The funds will be used for team expansion, tape-out iteration, and equipment supplementation.
Liangyin Technology, founded in 2024, focuses on photonic integrated circuits, developing silicon photonic transmission chips (PIC), Optical IO (OIO), and co-packaged optics (CPO). The founding team includes Li Yaoji, founder, with over 30 years of IC industry experience, and Zhao Jingxiong, co-founder and CTO, with experience at CUMEC, Cisco, and Intel. The company targets the high-barrier market via microring modulators (MRM), which offer micron-scale size and low drive voltage, adapting to high-density advanced packaging. They have built 1.6T and higher-rate silicon photonic chips based on self-developed single-channel 200G MRM, and are developing CPO solutions and Optical I/O Chiplets products. They have addressed MRM temperature sensitivity with real-time temperature control and electrical equalization algorithm IP, and master self-developed silicon photonic PDK, using mature CMOS process nodes for production. The company completed its latest 1.6T MRM optical chip tape-out and is currently testing. They are collaborating with leading domestic GPU manufacturers, entering the PoC stage, and working with packaging houses on TSV 3D stacking advanced packaging.
- Abbreviations
- CPO = Co-Packaged Optics — совместно упакованная оптика
- OIO = Optical IO — оптический ввод/вывод
- PIC = Photonic Integrated Circuit — фотонная интегральная схема
- MRM = Microring Modulator — микрокольцевой модулятор
- PDK = Process Design Kit — комплект проектирования технологического процесса
- CMOS = Complementary Metal-Oxide-Semiconductor — комплементарный металл-оксид-полупроводник
- DSP = Digital Signal Processor — цифровой сигнальный процессор
- TSV = Through-Silicon Via — сквозное кремниевое отверстие
- FSR = Free Spectral Range — свободный спектральный диапазон
- DWDM = Dense Wavelength Division Multiplexing — плотное мультиплексирование с разделением по длине волны
- PoC = Proof of Concept — подтверждение концепции
- GPU = Graphics Processing Unit — графический процессор
- CPU = Central Processing Unit — центральный процессор
- EML = Electro-absorption Modulated Laser — лазер с электроабсорбционной модуляцией
- MZM = Mach-Zehnder Modulator — модулятор Маха-Цендера
- Driver IC = Driver Integrated Circuit — интегральная схема драйвера
- TIA = Transimpedance Amplifier — трансимпедансный усилитель
Source: 36Kr —
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